Laser drilling and AOI enhancement
Planned UV/CO₂ laser drilling, enhanced automated optical inspection and aluminium-volume process additions.
Production todayThe parameters below describe Brandner’s current manufacturing offer. Final capability depends on design review, material availability and qualification requirements.
| Parameter | Standard offering |
|---|---|
| Layer count | 1–24 layers |
| Minimum track / spacing | 0.075 mm / 0.075 mm |
| Finished board thickness | 0.40–3.20 mm |
| Copper thickness | 18–210 µm |
| Minimum finished hole | 0.20 mm, subject to aspect ratio |
| Materials | FR-4, high-Tg FR-4, aluminium core |
| Surface finishes | ENIG, lead-free HASL, OSP |
| Solder mask | Green standard; other colours by review |
| Testing | Electrical test; AOI and inspection by process plan |
| Production quantities | Prototype through repeat production |
| Quality system | ISO 9001:2015 — certified by Kiwa Estonia |
Investment roadmap
Capability expansion
Medical quality system
ISO 13485 is a planned qualification programme and is not presented as a current certification.
Start a project
Send us your PCB package.
Gerber or ODB++ data, fabrication drawing, quantities and required delivery date.